External assembly element with integrated communication circuit
US11048213B2 · kind B2 · utility
1Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2016 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Jan 4, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG04G21/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An external assembly element of a timepiece made from a first material, including a groove in which a communication circuit is arranged, wherein the communication circuit is over-molded with a polymer material filling the groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.