Integrated circuit chip device with thermal control
US11049788B2 · kind B2 · utility
1Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 18, 2019 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Oct 18, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit chip device configured provide thermal control by directing heat transfer away from a heat sensitive component. The structure directs the heat transfer away from the heat sensitive component so that the heat sensitive component can be maintained at reduced operating temperatures for improved performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.