Electronic power module comprising a dielectric support
US11049795B2 · kind B2 · utility
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3References
17Claims
0Family size
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Key dates
| Filing date | Jan 29, 2018 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Jan 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power electronic module (1) including at least one semiconductor (5) that is connected to connection conductors (6, 7), and including a dielectric carrier (10) having both a fixed layer (9), on which at least one of said connection conductors (6) is mounted, and a movable layer (11), the fixed layer (9) and the movable layer (11) exhibiting similar dielectric permittivities and being superposed along at least one surface facing the at least one connection conductor (6).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.