Systems and methods for the use of fraud prevention fluid to prevent chip fraud
US11049822B1 · kind B1 · utility
2Cited by
128References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2019 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Dec 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/573
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Example embodiments of systems and methods for creating a chip fraud prevention system with a fraud prevention fluid are provided. A chip fraud prevention system includes a device including a chip. The chip may be at least partially encompassed in a chip pocket which contains a fraud prevention fluid. The fraud prevention fluid may be contained in a capsule or implemented as an adhesive. One or more connections may be communicatively coupled to at least one surface of the chip. The one or more connections may be placed in close proximity and/or in contact to the fraud prevention fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.