Systems and methods for manufacturing semiconductor modules
US11049898B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2017 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Apr 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.