Assembly with at least one antenna and a thermal insulation component
US11050144B1 · kind B1 · utility
3Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 2020 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | May 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/422
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Some embodiments of the present disclosure relate to an assembly. In some embodiments the assembly comprises at least one antenna and a thermal insulation component. In some embodiments, the at least one antenna is configured to transmit a field of radiofrequency (RF) communication at an operating frequency ranging from 6 GHz to 100 GHz. In some embodiments, the thermal insulation component is disposed within the field of RF communication. In some embodiments, the thermal insulation component has a thermal conductivity ranging from 0.0025 W/m·K to 0.025 W/m·K at 25° C. and 1 atm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.