Encapsulation method, device and node
US11050664B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2018 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | May 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L2212/00
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
An encapsulation method, an encapsulation device and an encapsulation node are disclosed. The encapsulation method includes: embedding, at an encapsulation node in an in-situ operation administration and maintenance, IOAM, domain, IOAM information in a segment routing multi-protocol label switching, SR MPLS, header. The IOAM information includes: an IOAM header and an IOAM payload. The IOAM header includes a MPLS label value assigned by internet assigned numbers authority, IANA; and the IOAM header further includes at least one of: a value identifying whether the IOAM header is at a bottom of a stack, a packet priority field, and an encoded time-to-live value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.