Ejectable component assemblies in electronic devices
US11050865B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2019 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Apr 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04M2250/14
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.