Modular server design
US11051422B2 · kind B2 · utility
11Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2018 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Sep 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1498
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular compute platform including an enclosure, a first module including an application specific integrated circuit, the first module being disposed in the enclosure, a second module including an input/output device, the second module being disposed in the enclosure, the input/output device connected to the first module through a first cable, and a third module including a media device disposed in the enclosure, the media device connected to the first module through a second cable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.