Electronic device comprising heat-dissipating structure
US11051435B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2018 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Nov 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device according to various embodiments of the disclosure may include a housing including a front plate and a rear plate facing the front plate, a display exposed through at least part of the front plate, an intermediate plate interposed between the display and the rear plate, and including a first face facing the display and a second face facing the rear plate, a first printed circuit board interposed between the display and the intermediate plate, a first electronic component attached to a first portion of the second face, a second electronic component attached to a second portion, away from the first portion, of the second face, and a first heat-dissipating structure extended between the first portion and the second portion along the second face.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.