Methods for laser processing transparent workpieces using pulsed laser beam focal lines and vapor etching

US11052481B2 · kind B2 · utility

Assignee

• CORNING INCORPORATED · US

Inventors

• Heather Debra Boek · Corning, US
• Andreas Simon Gaab · Gröbenzell, DE
• Garrett Andrew Piech · Corning, US
• Alranzo Boh Ruffin · Corning, US
• Daniel Arthur Sternquist · Horseheads, US
• Michael Brian Webb · Lindley, US

Key dates

• Filing date: Jan 29, 2020
• Grant date: Jul 6, 2021
• Expiry date: Jan 29, 2040

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K26/362
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method for processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, thereby forming a damage line within the transparent workpiece, and the portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength λ, a spot size w0, and a Rayleigh range ZR that is greater than where FD is a dimensionless divergence factor comprising a value of 10 or greater. Further, the method for processing the transparent workpiece includes etching the transparent workpiece with an etching vapor to remove at least a portion of the transparent workpiece along the damage line, thereby forming an aperture extending through the at least a portion of the thickness of the transparent workpiece.