Method for laser processing
US11052489B2 · kind B2 · utility
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4References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2018 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Oct 5, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a laser processing method, laser lights of fiber lasers or direct diode lasers is irradiated onto an iron-based plate material from a nozzle, a nozzle with a nozzle opening whose opening diameter is preliminarily set according to a thickness of the plate material is selected from plural nozzles whose nozzle openings have different opening diameters from each other, and the plate material is cut while irradiating the laser lights onto the plate material and injecting assist gas from the nozzle opening toward the plate material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.