Molding method and molding system for resin molded member
US11052581B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 11, 2017 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Dec 24, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3055
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molding method and a molding system for improving a molding speed of a resin molded member. In the method, firstly a thermoplastic resin composite material is filled in a metal mold (i.e., at time T0), and subsequently a mold-clamping process gets started. As the mold-clamping process progresses, a first decompression circuit starts to decompress an inside of a cavity when the cavity is closed by a sealing member provided on the metal mold. Then, as the mold-clamping process further progresses, the thermoplastic resin composite material thus filled in the metal mold contacts an upper mold of the metal mold (i.e., at time T2). After that, a second decompression circuit starts to decompress the inside of the cavity, thereby to complete the mold-clamping process (i.e., at time T3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.