Injection molded plastic object with an embedded electronic circuit printed on a paper base and method of its production
US11052584B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 15, 2016 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Aug 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method to embed a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based electronic circuit) directly into a moulded plastic piece (also designated as plastic object), the embedding of the paper-based electronic circuit and the production of the plastic piece being performed in a single operation. The invention thus also relates to a method to manufacture plastic objects embedding such label. The invention also concerns a plastic object encompassing a label essentially consisting of a paper substrate carrying electronic inks and/or a printed electronic circuit and/or device (thereby achieving a paper-based electronic circuit) embedded in the moulded plastic and in particular an object obtained by the method disclosed to prepare a moulded plastic piece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.