Fabrication apparatuses and methods
US11052619B1 · kind B1 · utility
0Cited by
19References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2017 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Feb 21, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2043/3644
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
One embodiment of a method according to the present disclosure may use a fixture with one or more boot recesses formed therein. An embedded member may be engaged with a boot and placed in a boot recess. Substrate lay-up may be placed around all or a portion of the embedded member and an outer member may be positioned over the substrate lay-up. A cover may be positioned over the outer member and engaged with the fixture. The pressure within an interior portion of the fixture may be reduced to less than ambient pressure and resin may be introduced to interact with the substrate lay-up and allowed to cure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.