Resin powder for solid freeform fabrication, device for fabricating solid freeform fabrication object, and resin powder
US11052649B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
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Key dates
| Filing date | Jun 13, 2018 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Feb 23, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L23/12
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A resin powder for solid freeform fabrication, having a melting point of 100 degrees C. or higher as measured according to ISO 3146 regulation and a ratio of melt mass-flow rate B to melt mass-flow rate A of greater than 0.80 to 1.20, wherein the melt mass-flow rate A and the melt mass-flow rate B are respectively measured at 15 degrees C. higher than the melting point under a load of 2.16 kg according to JIS K7210 format before and after the resin powder is maintained at a temperature 15 degrees C. lower than the melting point under a pressure of 0.1 kPa for four hours.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.