Alloying-element additive and method of manufacturing copper alloy
US11053569B2 · kind B2 · utility
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3Claims
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Key dates
| Filing date | Jan 29, 2016 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Feb 28, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2933
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An alloying-element additive for adding an alloy element to a copper melt formed by melting a base material including a copper in manufacturing a copper alloy. The alloying-element additive includes a wire-shaped or plate-shaped core including an alloy element, and an outer layer material including a copper and covering the core. A weight ratio of the copper in the outer layer material and the alloy element in the core is in a range of weight ratio where the alloying-element additive has a liquid phase in a temperature range of not more than a melting point of the copper in a copper-alloy element phase diagram.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.