Tin or tin alloy plating solution and bump forming method
US11053600B2 · kind B2 · utility
0Cited by
1References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 19, 2019 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Mar 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0723
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This tin or tin alloy plating solution includes a soluble salt including at least a stannous salt (A), an acid selected from an organic acid and an inorganic acid or a salt thereof (B), a surfactant (C), benzalacetone (D), and a solvent (E), wherein the plating solution is used to form a pattern in which bump diameters are different from each other on a base material, an amount of the benzalacetone (D) is 0.05 g/L to 0.2 g/L, a mass ratio (C/D) of the surfactant (C) to the benzalacetone (D) is 10 to 200, and a mass ratio (E/D) of the solvent (E) to the benzalacetone (D) is 10 or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.