Patent · US Active

Metallic structure and a method for surface treatment of a metallic structure

US11053605B2 · kind B2 · utility

1Cited by

2References

18Claims

0Family size

Assignee

CITY UNIVERSITY OF HONG KONG · CN

Inventors

Binbin Zhou · Singapore, SG
Junda Shen · Kowloon, CN
Yang Li · Santa Clara, US
Jian Lu · Kowloon, CN

Key dates

Filing date	Jul 25, 2019
Grant date	Jul 6, 2021
Priority date	—
Expiry date	Jul 25, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG01N21/658
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A metallic structure and a method for surface treatment of a metallic structure. The method includes the steps of: defining a first surface morphology on a surface of the metallic structure using a first surface treatment process; and manipulating the surface using a second surface treatment process to transform the first surface morphology to a second surface morphology; wherein the metallic structure is substantially made of a first metallic material; and wherein the second surface treatment process includes performing at least one cycle of depositing the first metallic material on the surface of the metallic structure and etching away at least some of the first metallic material from the metallic structure.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.