Floor heating system including membranes that are configured to be joined together to house a heating cable, and flooring underlayment including such membranes
US11054147B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 2020 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Nov 9, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/00
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A flooring underlayment includes a base membrane and a cover membrane. The base membrane is configured to be installed between a subfloor and floor tiles to allow movement of the floor tiles relative to the subfloor. The base membrane includes a base layer and studs projecting from the base layer. The studs have free ends that define pockets therein. The cover membrane is configured to be coupled to the base membrane to form a flat surface for supporting the floor tiles. The cover membrane includes a cover layer and studs projecting from the cover layer. The studs on the cover membrane are configured to fit within the pockets in the base membrane to couple the cover membrane to the base membrane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.