Sensor chip
US11054533B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Jun 20, 2017 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Mar 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/953
- WIPO fieldEnvironmental technology
- WIPO sectorChemistry
Abstract
An SiPM sensor chip includes pixels consisting of microcells Z, each pixel being associated with an xy position x1, x2, x3, . . . , xN or y1, y2, y3, . . . yM. A plurality of pixels form a block, and the microcells are connected to output channels for a linear coding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.