Patent · US Active

Electro-optical package and method of fabrication

US11054597B2 · kind B2 · utility

5Cited by

12References

21Claims

0Family size

Assignee

Rockley Photonics Limited · GB

Inventors

Vivek Raghunathan · Mountain View, US
Vivek Raghuraman · Santa Clara, US
Karlheinz Muth · Hannover, DE
David Arlo Nelson · Fort Collins, US
Chia-Te Chou · New Taipei, TW
Brett Michael Dunn Sawyer · Pasadena, US
Seungjae Lee · Paju-si, KR

Key dates

Filing date	Apr 11, 2019
Grant date	Jul 6, 2021
Priority date	—
Expiry date	Apr 11, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10378
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.