Haptic actuator using force multiplying spring and smart alloy wire
US11054904B2 · kind B2 · utility
0Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 8, 2018 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Dec 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N2/009
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A haptic feedback device includes a mechanical ground and a haptic surface. A plurality of connection points is connected to the mechanical ground and a plurality of connection points is connected to the haptic surface. An electroreactive wire extends around the plurality of connection point connected to the mechanical ground and the plurality of connection points connected to the haptic surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.