Semiconductor separation device
US11056354B2 · kind B2 · utility
0Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2019 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Jun 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06593
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Described is a semiconductor substrate stack, including: a plurality of semiconductor substrates arranged in a stack in which the semiconductor substrates include opposing facing surfaces, wherein the facing surfaces of adjacent semiconductor substrates are separated by a gap, each semiconductor substrate having an edge surface at an exposed edge of the stack. A spacer is attached to one of the facing surfaces of each of the at least one of the semiconductor substrates and extends between adjacent semiconductor substrates to define the gap and mask a central portion of each respective semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.