Semiconductor module
US11056422B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | May 29, 2018 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Aug 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.