Semiconductor relay module
US11057034B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2017 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Dec 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2217/0009
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In a semiconductor relay module, inside a package, one of a pair of input parts of a first semiconductor relay is connected to a first input terminal, the other of the pair of input parts of the first semiconductor relay is connected to a second input terminal, one of a pair of input parts of a second semiconductor relay is connected to the second input terminal, the other of the pair of input parts of the second semiconductor relay is connected to the first input terminal, one of a pair of input parts of a third semiconductor relay is connected to a third input terminal, and the other of the pair of input parts of the third semiconductor relay is connected to the first input terminal or the second input terminal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.