Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions
US11058007B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2018 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Nov 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component carrier with a) a first component carrier portion having a blind opening; b) a component arranged in the blind opening; and c) a second component carrier portion at least partially filling the blind opening. At least one of the first component carrier portion and the second component carrier portion includes a flexible component carrier material, and the first component carrier portion and the second component carrier portion form a stack of a plurality of electrically insulating layer structures and/or electrically conductive layer structures. It is further described a method for manufacturing such a component carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.