PCB panel, PCB, and manufacturing method
US11058008B2 · kind B2 · utility
0Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2019 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Sep 18, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A manufacturing method, Printed Circuit Board (PCB) panel, and a PCB are disclosed. The method includes forming a cavity in a PCB that is in a PCB panel that includes a frame and stays, mounting an electronic component, heating the PCB panel, and cutting the stays. The PCB panel includes a frame body and a PCB coupled to the frame body via stays. The PCB includes a cavity. A first cavity stay is located near the cavity. Extended lines extend from the cavity, and the cavity stay extends at least between the extended lines. The PCB includes a cavity and a connection point from a cavity stay near the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.