Barrier layer
US11058011B2 · kind B2 · utility
1Cited by
0References
19Claims
0Family size
Inventors
Key dates
| Filing date | Mar 10, 2018 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | May 12, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.