Method of manufacturing battery module and interconnect board assembly with integrated PCB and flex circuit
US11058013B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2019 |
| Grant date | Jul 6, 2021 |
| Priority date | — |
| Expiry date | Feb 14, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing an interconnect board (ICB) assembly for a battery module, the ICB assembly having a printed circuit board assembly (PCBA) and a carrier frame, includes depositing solder paste onto a printed circuit board (PCB) and/or a flexible printed circuit (flex circuit). The flex circuit has a conductive foil substrate coated with insulating material, and defines tabular flying leads radially-projecting from the flex circuit's periphery. The method may include positioning the PCB adjacent to the flex circuit such that the PCB and flex circuit are in direct contact along a flex interface surface of the PCB, and integrally joining the PCB and flex circuit along the interface surface to form the PCBA. The PCBA connects to the carrier frame to construct the ICB assembly. The battery module may be manufactured by connecting the ICB assembly to battery cells of the battery module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.