Dipping bath compositions for treating reinforcing inserts
US11059950B2 · kind B2 · utility
3Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2019 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Jul 25, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/312
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to an aqueous, solids-containing dipping bath composition for treating reinforcing inserts for rubber products comprising the following components or consisting of these components, (A) at least one blocked MDI mixture, the MDI mixture comprising MDI oligomers of formula (I), n being a whole number from 1 to 8, and MDI monomers; (B) at least one resorcinol-formaldehyde latex; and (C) possibly at least one additive, wherein the dipping bath composition is essentially free of epoxides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.