Thermally conductive composition
US11059971B2 · kind B2 · utility
1Cited by
18References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided are a composition, a cured polymer material formed from said composition, a method for forming a thermally conductive material on an article and an article having a thermally conductive material. Said thermally conductive material can be formed on an electronic device, and can be peeled off from said electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.