Silicone resin, related methods, and film formed therewith
US11059994B2 · kind B2 · utility
0Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2018 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Jul 30, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A silicone resin is disclosed. The silicone resin is free from carbon atoms. A method of preparing the resin is additionally disclosed. This method comprises reacting a silane compound and a precursor compound, thereby preparing the silicone resin. A composition including the silicon resin and a vehicle is further disclosed. A method of preparing a film with the composition is also disclosed. This method comprises applying the composition including the silicone resin and the vehicle to a substrate to form a layer. This method also includes heating the layer to give the film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.