Tin alloy plating solution
US11060200B2 · kind B2 · utility
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3References
18Claims
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Inventor
Key dates
| Filing date | Jun 28, 2019 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Jun 28, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/64
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A tin alloy plating solution includes a soluble tin salt, a soluble salt of a metal more noble than tin, and a sulfide compound represented by General Formula (1). In the General Formula (1), (A) is a hydrocarbon group including no oxygen atom and having 1 to 2 carbon atoms, or (A) is a hydrocarbon group including one or more oxygen atoms and having 2 to 6 carbon atoms. The metal which is more noble than tin is preferably silver, copper, gold or bismuth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.