Method of inspection by guided waves
US11060860B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 23, 2017 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Jul 20, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2291/2694
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of non-destructively inspecting an adhesively bonded assembly of first, second, and third materials includes generating guided waves in the adhesively bonded assembly and establishing a dispersion curve plot in a first reference frame on the basis of receiving the guided waves. The method further includes comparing the dispersion curve plot with a plurality of reference dispersion curves established in the first reference frame, each of the reference dispersion curves being obtained by generating guided waves in a reference adhesively bonded assembly. Finally, the method includes estimating at least one of the thicknesses of the materials in the adhesively bonded assembly under inspection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.