Solder bump height stabilization for micro and fine pitch electrode pads
US11062731B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 11, 2020 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | May 11, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4853
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Approaches to pre-forming solder bumps, such as for use in electrically connecting a head slider and a suspension assembly for a hard disk drive, involves applying a height stabilizer plate over a shared solder paste applied over a substrate housing electrode pads, and reflowing the solder paste with the plate applied to create solder bumps electrically coupled to the pads. Use of such a plate functions to stabilize and contain the solder paste and create uniform solder bumps across the series of pads, where the plate may be composed of a heat-resistant and anti-solder-wetting material. The solder bump pre-forming techniques generally enable solder bonding of extremely small electrical interconnection pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.