Semiconductor apparatus with inner wafer carrier buffer and method
US11062931B2 · kind B2 · utility
0Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2019 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Oct 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67201
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides one embodiment of a semiconductor processing apparatus. The semiconductor processing apparatus includes a load lock designed to receive a wafer carrier; an inner wafer carrier buffer configured to hold the wafer carrier received from the load lock and to perform a nitrogen purge to the wafer carrier; and a processing module designed to perform a semiconductor process to wafers from the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.