Transfer stamps with multiple separate pedestals
US11062936B1 · kind B1 · utility
8Cited by
74References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 2019 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Dec 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A stamp for micro-transfer printing comprises a rigid support having a support coefficient of thermal expansion (support CTE). Pedestals are disposed on (e.g., directly on and in contact with) the rigid support. Each of the pedestals is spatially separated from any other of the pedestals. The pedestals have a pedestal coefficient of thermal expansion (pedestal CTE) and the pedestal CTE is greater than the support CTE. Posts are disposed on (e.g., directly on and in contact with) each of the pedestals. Each post has a post coefficient of thermal expansion (post CTE) that is greater than the support CTE.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.