Semiconductor package and antenna module comprising the same
US11062999B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2019 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Sep 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes a core structure having a first through-hole and including a frame having an opening, a passive component disposed in the opening, a first encapsulant covering the frame and the passive component, a first metal layer disposed on an inner surface of the first through-hole, and a second metal layer disposed on an inner surface of the opening; a first semiconductor chip disposed in the first through-hole and having a first connection pad; a second encapsulant covering the core structure and the first semiconductor chip; a connection structure disposed on the core structure and the first semiconductor chip and including a redistribution layer; and a metal pattern layer disposed on the second encapsulant. The first and second metal layers are connected to the metal pattern layer through first and second metal vias having heights different from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.