Semiconductor device and method of manufacturing thereof
US11063001B2 · kind B2 · utility
0Cited by
59References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2019 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Sep 9, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device and a method of manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device comprising one or more conductive shielding members and an EMI shielding layer, and a method of manufacturing thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.