Power supply module and manufacture method for same
US11063525B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2019 |
| Grant date | Jul 13, 2021 |
| Priority date | — |
| Expiry date | Dec 29, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a power supply module and a manufacture method thereof, belonging to the technical field of power electronics. According to the present disclosure, a unibody conductive member is employed to connect a conductive part in a passive element to a conductive layer in a substrate. This is advantageous in simplifying the structure of the passive element, and enabling a structurally compact power supply module at a reduced cost. Additionally, stacking the passive element with the substrate may allow for a further compact structure for the power supply module, improving the space utilization rate for the power supply module, while enhancing the external appearance of the power supply module with tidiness, simplicity and aesthetics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.