Insert for integration into trim layer and providing conditioning
US11065991B2 · kind B2 · utility
5Cited by
22References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2018 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Sep 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/029
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
An insert comprising: (a) a cover layer; (b) a spacer layer located below the cover layer; (c) a connection material that is adapted to extend between and connect the cover layer to a trim layer so that the insert is fixed to the trim layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.