Patent · US Active

Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions

US11066553B2 · kind B2 · utility

1Cited by

12References

21Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Heiko Brunner · Berlin, DE
Lars Kohlmann · Berlin, DE
Agnieszka Witczak · Berlin, DE
Olivier Mann · Berlin, DE

Key dates

Filing date	Aug 19, 2016
Grant date	Jul 20, 2021
Priority date	—
Expiry date	Aug 19, 2036

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D3/38
WIPO fieldOrganic fine chemistry
WIPO sectorChemistry

Abstract

The present invention relates to imidazoyl urea polymers and their use in aqueous acidic plating baths for metal or metal alloy deposition such as electrolytic deposition of copper or alloys thereof in the manufacture of printed circuit boards, IC substrates, semiconducting and glass devices for electronic applications. The plating bath according to the present invention comprises at least one source of metal ions and an imidazoyl urea polymer. The plating bath is particularly useful for filling recessed structures and build-up of pillar bump structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.