Pattern forming method, under coating agent, and laminate
US11066571B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 30, 2017 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Sep 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/0271
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
It is an object of the present invention to provide a pattern forming method capable of easily forming a phase-separated structure with high accuracy, even in the case of widening the applicable range of a pattern size. The present invention relates to a pattern forming method comprising: applying an under coating agent onto a substrate, and applying a self-assembly composition for pattern formation to the surface of the substrate, onto which the under coating agent has been applied, and then forming a self-assembly film according to self-assembly phase separation, wherein the self-assembly composition for pattern formation comprises a block copolymer comprising a polymerization unit (a) having at least one selected from a structure represented by a formula (103) and a structure represented by a formula (104), and a polymerization unit (b) having a structure represented by a formula (105).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.