Drywall joint tape with dual purpose adhesive backing
US11066576B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2016 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Mar 7, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2401/006
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A joint tape to be applied to wallboard is provided and includes a base substrate having opposing sides. In certain embodiments, a first adhesive layer is applied to one of the sides of the base substrate and a second adhesive layer is applied to the first adhesive layer, where the first adhesive layer is different than the second adhesive layer. In certain other embodiments, two different adhesives are used in a single adhesive layer. In use, the joint tape is positioned over and removably secured to a joint or corner between adjacent wallboard panels using the first adhesive layer. After the joint tape is in position, joint compound is applied to the joint tape, and the water in the joint tape activates it to form a secure bond with the wallboard panels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.