Mounting electronics and monitoring strain of electronics
US11066922B2 · kind B2 · utility
2Cited by
4References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 31, 2016 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | May 3, 2037 |
Classification
- Technology area (CPC E)Fixed Constructions
- CPC primaryE21B47/017
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A system for mounting electronics is disclosed. The system may include a tool and a chassis having a mounting surface. The system may also include an electronics assembly coupled to the chassis. A low modulus spacer may be coupled to the chassis between the mounting surface of the chassis and the electronics assembly. A fastener may couple the electronics assembly and the low modulus spacer to the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.