Passively deployable thermal management devices, systems, and methods
US11067345B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2018 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Jun 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/467
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Passively deployable thermal management devices, systems, and methods are provided in accordance with various embodiments. For example, some embodiments include a passively deployable radiator device that may include: one or more thermally conductive layers; and/or one or more strain energy components configured to deploy passively the one or more thermally conductive layers. The one or more thermally conductive layers may include one or more carbon layers. The one or more carbon layers may include at least one or more graphite layers or one or more graphene layers. At least the one or more graphite layers or the one or more graphene layers include at least one or more pyrolytic graphite sheets or one or more pyrolytic graphene sheets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.