Integrated packaged light engine and signal transmitting and receiving method thereof
US11067763B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2020 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Mar 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Disclosed are an integrated packaged light engine and signal emitting and receiving method thereof. The light engine includes molded interconnection device in which ceramic substrate is embedded, laser chip, photodiode chip, optical driving chip, transimpedance amplifier chip, array lens module and optical fiber interface provided on the ceramic substrate; the signal transmitting method includes: S1, powering optical drive chip by external power supply; S2, transmitting external signal to optical drive chip, so that laser chip emits optical signal; S3, totally reflecting and then transmitting optical signal by array lens module. The signal receiving method includes: S1, optical signal entering optical fiber interface; S2, optical signal entering array lens module; S3, transmitting optical signal to photodiode chip by array lens module; S4, converting and then transmitting optical signal into electrical signal to transimpedance amplifier chip by photodiode chip; S5, transmitting electrical signal to external circuit by transimpedance amplifier chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.