System and method for thermal management in a multicomponent system
US11067963B2 · kind B2 · utility
1Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2019 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Dec 5, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/49219
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
An information handling system includes a chassis and a payload. The chassis directs an airflow along the payload. The payload includes a heatsink for cooling a first component using a first portion of the airflow and an airflow directing heatsink for cooling a second component. The airflow directing heatsink uses both of the first portion of the airflow and a second portion of the airflow for cooling the second component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.