Enrolment case for smart card
US11068766B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2020 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Apr 28, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K7/0069
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is a semi-rigid enrolment case for a smart card, formed by folding and gluing an envelope-like cardboard blank of the dimensions of the card. The case includes an electrical circuit printed directly on the cardboard of an inner surface. The circuit includes contact studs connected to a power supply interface and arranged to connect electrical contacts of the card to the power supply interface when the card is inserted into the case. A biometric sensor of the card remains accessible to the user when it is out of the case for making the enrolment. Through-openings are made in the cardboard on either side of contact stud lines and allow forming independent flexible areas, providing better contact between the studs and the electrical contacts of the card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.